Tesla's new FSD chip delivers five times more computing power

Tesla's next-generation FSD (Full Self-Driving) chip, the AI5/HW5, represents a significant step forward in the development of the company's self-driving technology. Although the previous model, known as HW4, already offered powerful performance on its own, the new chip's 2000-2500 TOPS (tera operations per second) computing power effectively sets a new standard for in-vehicle artificial intelligence applications. This fivefold increase is not just a technical feat, but also allows the system to work with more complex, finely tuned algorithms that require less human intervention – algorithms that bring us closer to the possibility of completely unsupervised driving.

However, the hardware upgrade is not just about increasing absolute performance. Tesla's approach remains gradual: the system will only become autonomous by default when it can be proven to operate more safely than a human driver. By this measure, the company clearly distances itself from simultaneous mass updates – even if the technology is already available for certain vehicles. The decision is based not only on technical or market considerations, but also on a safety-focused development philosophy.

The development of the new chip is also closely linked to the further development of the FSD camera system. The updated sensors, which are now weatherproof and feature integrated heating, significantly improve the system's detection capabilities, especially in extreme environmental conditions. This is a key step forward, as camera-based perception remains one of the cornerstones of the FSD system. Tesla's recently launched robotaxi pilot program, which initially involves Model Y vehicles equipped with HW4 chips, demonstrates that the company is testing the performance of its new hardware in real-world environments, not just in theory. 

Share this post
Production cuts at Intel: More than 10,000 employees may be affected by wave of factory closures
News of the cuts affecting Intel's manufacturing division first came to light last week, but the details were not yet known at that time. However, according to the latest reports, the situation is more serious than previously thought: one of the world's largest chip manufacturers is planning a 15-20% reduction in headcount in the Intel Foundry (foundry manufacturing) division. This could affect more than 10,000 factory workers worldwide, according to OregonLive.
Apple's Next Chip: A Glimpse into Future iPhones
Reports suggest that Apple's A20 chipset, anticipated to be manufactured using TSMC's advanced 2nm process, will feature Wafer-Level Multi-Chip Module (WMCM) packaging. This technological integration is expected to be exclusive to specific forthcoming Apple devices: the iPhone 18 Pro, iPhone 18 Pro Max, and the company's rumored foldable smartphone, which some sources refer to as the iPhone 18 Fold.
Fierce competition between Samsung and TSMC to dominate 2 nanometre manufacturing technology
At the forefront of chipmaking, Samsung is making significant efforts to develop 2 nanometre Gate-All-Around (GAA) technology, which is key to the production of next-generation processors such as the Exynos 2600 and Snapdragon 8 Elite Gen 2. The South Korean giant aims to compete with market leader TSMC while facing a number of challenges, particularly in terms of manufacturing yields.
Turnaround: are European and Japanese carmakers also replacing American chips with Chinese ones?
Chinese-made system-on-chip (SoC) chips for vehicles are becoming increasingly prominent in the global market. While US-based NVIDIA and Qualcomm products have gained ground in mid- and high-end cars, Chinese semiconductor manufacturers are increasing their influence in the mass-market segment. They no longer stand out only for their cost-effectiveness, but are also outperforming their competitors in terms of performance.